PCB Categories

Home > Hybrid PCB > Hybrid High Frequency Printed Circuit Boards 3-Layer Hybrid RF PCB Made On 13.3mil RO4350B and 31mil RT/Duroid 5880
Hybrid High Frequency Printed Circuit Boards 3-Layer Hybrid RF PCB Made On 13.3mil RO4350B and 31mil RT/Duroid 5880

(PCBs are custom-made products, the picture and parameters shown are just for reference)


Introduction

Hello Everyone,
Warm greetings!
Today, we will discuss hybrid PCBs, which can consist of a combination of FR-4 and high-frequency materials, or a blend of different high-frequency materials with varying dielectric constants (DK), such as RT/Duroid 5880 and RO4350B.


This article focuses on a specific type of mixed high-frequency PCB constructed from 13.3mil (0.338mm) RO4350B and 31mil (0.787mm) RT/Duroid 5880, designed for multi-coupler antenna applications.


This is a 3-layer board that one layer is etched off.


Basic Specifications：

Basic Specifications Description
Base Material RO4350B 13.3mil (0.338mm) + RT/Duroid 5880 31mil (0.787mm)
Dielectric Constant 3.48 ± 0.05
Layer Count 3 layers
Via Type Through holes, blind vias
Format 160mm x 90mm = 1 type = 1 piece
Surface Finish Immersion gold
Copper Weight Outer layer 35μm
Solder Mask / Legend Green / White
Final PCB Height 1.3 mm
Standard IPC 6012 Class 2
Packing 20 panels per shipment
Lead Time 20 working days
Shelf Life 6 months

Features and Benefits

1.Lowest Electrical Loss: Reinforced PTFE material ensures minimal signal loss.
2.Enhanced Electrical Performance: Optimized for high-frequency applications.
3.Large Workshop Capacity: 16,000 square meters dedicated to PCB manufacturing.
4.Production Capability: 30,000 square meters of production capacity per month.
5.Diverse Product Range: Capability to produce 8,000 types of PCBs monthly.
6.Extensive Experience: Over 17 years in the PCB industry.


Applications

Point-to-Point Digital Radio Antennas
WiFi Amplifiers
Tower-Mounted Boosters
Power Amplifiers
RF Modules



Properties of RT/Duroid 5880

Click to expand/collapse the table

RT/duroid 5880 Typical Value

Property

RT/duroid 5880

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

2.20
2.20±0.02 spec.

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Dielectric Constant,εDesign

2.2

Z

N/A

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.0004
0.0009

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Thermal Coefficient of ε

-125

Z

ppm/℃

-50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

2 x 107

Z

Mohm cm

C/96/35/90

ASTM D 257

Surface Resistivity

3 x 107

Z

Mohm

C/96/35/90

ASTM D 257

Specific Heat

0.96(0.23）

N/A

j/g/k
(cal/g/c)

N/A

Calculated

Tensile Modulus

Test at 23℃

Test at 100℃

N/A

MPa(kpsi)

A

ASTM D 638

1070(156)

450(65)

X

860(125)

380(55)

Y

Ultimate Stress

29(4.2)

20(2.9)

X

27(3.9）

18(2.6)

Y

Ultimate Strain

6

7.2

X

%

4.9

5.8

Y

Compressive Modulus

710(103)

500(73)

X

MPa(kpsi)

A

ASTM D 695

710(103)

500(73)

Y

940(136)

670(97)

Z

Ultimate Stress

27(3.9)

22(3.2)

X

29(5.3)

21(3.1)

Y

52(7.5)

43(6.3)

Z

Ultimate Strain

8.5

8.4

X

%

7.7

7.8

Y

12.5

17.6

Z

Moisture Absorption

0.02

N/A

%

0.62"(1.6mm) D48/50

ASTM D 570

Thermal Conductivity

0.2

Z

W/m/k

80℃

ASTM C 518

Coefficient of Thermal Expansion

31
48
237

X
Y
Z

ppm/℃

0-100℃

IPC-TM-650 2.4.41

Td

500

N/A

℃ TGA

N/A

ASTM D 3850

Density

2.2

N/A

gm/cm3

N/A

ASTM D 792

Copper Peel

31.2(5.5)

N/A

Pli(N/mm)

1oz(35mm)EDC foil
after solder float

IPC-TM-650 2.4.8

Flammability

V-0

N/A

N/A

N/A

UL 94

Lead-free Process Compatible

Yes

N/A

N/A

N/A

N/A


For further inquiries and detailed specifications, please feel free to contact us regarding your PCB needs. Feel free to adjust any specific terms or details as necessary!



Next Hybrid PCB Built on 8mil (0.203mm) RO4003C and 0.2mm FR-4 Multilayer High Frequency PCB Combining RO4003C and FR-4